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THERMAFILL-SERIES
premium aluminas for advanced applications
ThermaFill-Series
The ThermaFill Series introduces specialized alumina fillers engineered for enhanced performance in thermal interface applications.
These alumina-based fillers offer an economical solution for boosting thermal conductivity across various polymer systems, including silicone and epoxy.
By reducing viscosity and improving packing efficiency, ThermaFill enables increased filler loading, leading to enhanced thermal conductivity. This approach allows for more effective heat management in a range of applications, ensuring both performance and cost efficiency.
FUNCTIONAL FILLERS
THERMAFILL
Designed for increased thermal conductivity, providing heat dissipation in polymer systems of sylicone, epoxy, and more.
A greater package efficiency in resin systems allows higher filler loading with lower viscosity.
ThermaFill 1
Ground, crushed and roundish alumina
Mono-modal
D50 = 0.5µm
SSA = 7m²/g
Product Data Sheet
ThermaFill 2
Ground, crushed and roundish alumina
Mono-modal
D50 = 1.2µm
SSA = 3m²/g
Product Data Sheet
ThermaFill 3
Ground, crushed and roundish alumina
Bi-modal
D50 = 3µm
SSA = 3m²/g
Product Data Sheet
ThermaFill 4
Ground, crushed and roundish alumina
Mono-modal
D50 = 3µm
SSA = 2m²/g